Information
HP SSD S700 Series delivers compact storage and optimized performance for traditional and innovative small-form-factor and embedded platforms.
The case 2.5inch SSD design has a significantly smaller footprint than a 2.5inch hard disk drive (HDD), and enables fast read/write access times and a significant I/O and throughput performance improvement as compared to HDDs. This design makes it ideal for new and innovative small form factor computing platforms that have size and weight requirements that traditional 2.5inch HDD s cannot meet; such as, notebook, thin-and-light systems, mini-and sub-notebooks, all in-one computers, and embedded platforms.
features
• High performance
• Low power
• Increased system responsiveness
• High reliability
• Small form-factor
• Minimum weight
• Enhanced ruggedness
The case 2.5inch SSD design has a significantly smaller footprint than a 2.5inch hard disk drive (HDD), and enables fast read/write access times and a significant I/O and throughput performance improvement as compared to HDDs. This design makes it ideal for new and innovative small form factor computing platforms that have size and weight requirements that traditional 2.5inch HDD s cannot meet; such as, notebook, thin-and-light systems, mini-and sub-notebooks, all in-one computers, and embedded platforms.
features
• High performance
• Low power
• Increased system responsiveness
• High reliability
• Small form-factor
• Minimum weight
• Enhanced ruggedness
| Capacity: 500GB |
| Components: 3D TLC NAND Flash |
| Read and Write IOPS Random 4 KB reads: Up to 55 K IOPS Random 4 KB writes: Up to 80 K IOPS |
| Bandwidth Performance Sustained sequential read: Up to 560 MB/s Sustained sequential write: Up to 515MB/s |
| SATA 1.5 Gb/s ,3 Gb/s and 6 Gb/s interface ATA/ATAPI-7 SSD-enhanced S.M.A.R.T. ATA feature Native Command Queuing (NCQ) command set Data set management command Trim attribute |
| Form Factor Full-sized 2.5inch SSD Power Management 5 V 2.5inch SSD power supply 2.5inch SSD interface power management |
| Power (Mobile Mark 2007 Workload) Idle: 340 mW(TYP) max: 1.38W (TYP) |
| Temperature Operating: 0oC to 70oC Non-Operating: -40oC to 85oC |
| Shock (operating and non-operating) 100 G/6 msec |
| Vibration(operating and non-operating) 3.1G RMS (2-500 Hz) |
| Latency Read: 0.030ms (TYP) Write: 0.174ms (TYP) |
| Reliability Uncorrectable Bit Error Rate (UBER): 1 sector in 1016bits read Mean Time Between Failures (MTBF): 2,000,000 hours |
| Certifications and Declarations UL CE FCC RoHS |